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• 1. [Article] Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

  The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases ...

  Citation × Citation Citation Abstract Copy Title: Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance Author: Lee, Tae-Kyu, Chen, Zhiqiang, Guirguis, Cherif, Akinade, Kola Year: 2017 The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases with higher electric power condition, which brings the component into an elevated temperature environment, thus introducing another consideration factor for mechanical stability of interconnection joints. Since most of the shock performance data available were produced at room temperature, the effect of elevated temperature is of interest to ensure the reliability of the device in a mechanical shock environment. To achieve a stablea interconnect pound in a dynamic shock environment, the interconnections must tolerate mechanical strain, which is induced by the shock wave input and reaches the particular component interconnect joint. In this study, large body size (52.5 x 52.5 mm(2)) FCBGA components assembled on 2.4-mm-thick boards were tested with various isothermal pre-conditions and testing conditions. With a heating element embedded in the test board, a test temperature range from room temperature to 100A degrees C was established. The effects of elevated temperature on mechanical shock performance were investigated. Failure and degradation mechanisms are identified and discussed based on the microstructure evolution and grain structure transformations. Title: Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance Author: Lee, Tae-Kyu, Chen, Zhiqiang, Guirguis, Cherif, Akinade, Kola Year: 2017 The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases with higher electric power condition, which brings the component into an elevated temperature environment, thus introducing another consideration factor for mechanical stability of interconnection joints. Since most of the shock performance data available were produced at room temperature, the effect of elevated temperature is of interest to ensure the reliability of the device in a mechanical shock environment. To achieve a stablea interconnect pound in a dynamic shock environment, the interconnections must tolerate mechanical strain, which is induced by the shock wave input and reaches the particular component interconnect joint. In this study, large body size (52.5 x 52.5 mm(2)) FCBGA components assembled on 2.4-mm-thick boards were tested with various isothermal pre-conditions and testing conditions. With a heating element embedded in the test board, a test temperature range from room temperature to 100A degrees C was established. The effects of elevated temperature on mechanical shock performance were investigated. Failure and degradation mechanisms are identified and discussed based on the microstructure evolution and grain structure transformations. Close

• 2. [Article] Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

  The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed ...

  Citation × Citation Citation Abstract Copy Title: Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance Author: Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un Year: 2016 The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions. Title: Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance Author: Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un Year: 2016 The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions. Close

• 3. [Article] Estimation of Transient Temperature Distribution during Quenching, via a Parabolic Model

  A material-independent model to estimate the transient temperature distribution in a test probe quenched by immersion is presented in this study. This model is based on the assumption that, under one-dimensional ...

  Citation × Citation Citation Abstract Copy Title: Estimation of Transient Temperature Distribution during Quenching, via a Parabolic Model Author: Lozano, Diego E., Martinez-Solis, Gabriela, Mercado-Solis, Rafael David, Colás, Rafael, Totten, George E. Year: 2015 A material-independent model to estimate the transient temperature distribution in a test probe quenched by immersion is presented in this study. This model is based on the assumption that, under one-dimensional unsteady heat conduction, the radial temperature distribution at the end of an interval belongs to the equation of a parabola. The model was validated using AISI 304 stainless steel test probes (Φ8×40 mm and Φ12×60 mm) quenched from 850 to 900 °C in water and in water-based NaNO2 solutions at 25 °C and in canola oil at 50 °C. Additionally, square test probes (20×20×100 mm) were quenched from 550 °C in water. The test probes were equipped with embedded thermocouples for temperature-versus-time data logging at the core, one-quarter thickness and 1 mm below the surface. In each experiment, the data recordings from the core and near-surface thermocouples were employed for the temperature calculations while the data from the one-quarter thickness thermocouple were employed for model validity verifications. In all cases, the calculated temperature distributions showed good correlations with the experimentally obtained values. Based on the results of this work, it is concluded that this approach constitutes a simple, quick and efficient tool for estimating transient surface and radial temperature distributions and represents a useful resource for quenchant cooling rate calculations and heat transfer characterizations. Title: Estimation of Transient Temperature Distribution during Quenching, via a Parabolic Model Author: Lozano, Diego E., Martinez-Solis, Gabriela, Mercado-Solis, Rafael David, Colás, Rafael, Totten, George E. Year: 2015 A material-independent model to estimate the transient temperature distribution in a test probe quenched by immersion is presented in this study. This model is based on the assumption that, under one-dimensional unsteady heat conduction, the radial temperature distribution at the end of an interval belongs to the equation of a parabola. The model was validated using AISI 304 stainless steel test probes (Φ8×40 mm and Φ12×60 mm) quenched from 850 to 900 °C in water and in water-based NaNO2 solutions at 25 °C and in canola oil at 50 °C. Additionally, square test probes (20×20×100 mm) were quenched from 550 °C in water. The test probes were equipped with embedded thermocouples for temperature-versus-time data logging at the core, one-quarter thickness and 1 mm below the surface. In each experiment, the data recordings from the core and near-surface thermocouples were employed for the temperature calculations while the data from the one-quarter thickness thermocouple were employed for model validity verifications. In all cases, the calculated temperature distributions showed good correlations with the experimentally obtained values. Based on the results of this work, it is concluded that this approach constitutes a simple, quick and efficient tool for estimating transient surface and radial temperature distributions and represents a useful resource for quenchant cooling rate calculations and heat transfer characterizations. Close

• 4. [Article] Solder Material Experiencing Low Temperature Inelastic Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime

  Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints ...

  Citation × Citation Citation Abstract Copy Title: Solder Material Experiencing Low Temperature Inelastic Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime Author: Suhir, Ephraim, Ghaffarian, Reza, Yi, Sung Year: 2017 Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints of a package/PCB assembly experience inelastic strains. This takes place at low temperature conditions, when the deviation from the high fabrication temperature is the largest and the induced thermal stresses are the highest. On the other hand, it is well known that it is the combination of low temperatures and repetitive dynamic loading that accelerate dramatically the propagation of fatigue cracks, whether elastic or inelastic. Accordingly, a modification of the recently suggested Boltzmann–Arrhenius–Zhurkov model is developed for the evaluation of the remaining useful lifetime of the second level solder joint interconnection whose peripheral joints experience inelastic strains. The experimental basis of the approach is the highly focused and highly cost-effective failure-oriented-accelerated-testing (FOAT). The FOAT specimens are subjected in our methodology to the combined action of low temperatures (not to elevated temperatures, as in the classical Arrhenius model) and random vibrations with the given input energy spectrum. The suggested methodology is viewed as a possible, effective and attractive alternative to temperature cycling. As long as inelastic deformations take place, it is assumed that it is these deformations that determine the fatigue lifetime of the solder material, and the state of stress in the elastic mid-portion of the assembly does not have to be accounted for. The roles of the size and stiffness of this mid-portion have to be considered, however, when determining the very existence and establishing the size of the inelastic zones at the peripheral portions of the designs. The general concept is illustrated by a numerical example. Although this example is carried out for a ball-grid-array design, it is applicable to highly popular column-grid-array (CGA) and quad-flat-no-lead (QFN) designs as well. It is noteworthy that it is much easier to avoid inelastic strains in CGA and QFN structures than in the addressed BGA design. The random vibrations are considered in the developed methodology as a white noise of the given (m/s2)2/Hz—the ratio of the acceleration amplitudes squared to the vibration frequency. © 2016, Springer Science+Business Media New York. Title: Solder Material Experiencing Low Temperature Inelastic Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime Author: Suhir, Ephraim, Ghaffarian, Reza, Yi, Sung Year: 2017 Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints of a package/PCB assembly experience inelastic strains. This takes place at low temperature conditions, when the deviation from the high fabrication temperature is the largest and the induced thermal stresses are the highest. On the other hand, it is well known that it is the combination of low temperatures and repetitive dynamic loading that accelerate dramatically the propagation of fatigue cracks, whether elastic or inelastic. Accordingly, a modification of the recently suggested Boltzmann–Arrhenius–Zhurkov model is developed for the evaluation of the remaining useful lifetime of the second level solder joint interconnection whose peripheral joints experience inelastic strains. The experimental basis of the approach is the highly focused and highly cost-effective failure-oriented-accelerated-testing (FOAT). The FOAT specimens are subjected in our methodology to the combined action of low temperatures (not to elevated temperatures, as in the classical Arrhenius model) and random vibrations with the given input energy spectrum. The suggested methodology is viewed as a possible, effective and attractive alternative to temperature cycling. As long as inelastic deformations take place, it is assumed that it is these deformations that determine the fatigue lifetime of the solder material, and the state of stress in the elastic mid-portion of the assembly does not have to be accounted for. The roles of the size and stiffness of this mid-portion have to be considered, however, when determining the very existence and establishing the size of the inelastic zones at the peripheral portions of the designs. The general concept is illustrated by a numerical example. Although this example is carried out for a ball-grid-array design, it is applicable to highly popular column-grid-array (CGA) and quad-flat-no-lead (QFN) designs as well. It is noteworthy that it is much easier to avoid inelastic strains in CGA and QFN structures than in the addressed BGA design. The random vibrations are considered in the developed methodology as a white noise of the given (m/s2)2/Hz—the ratio of the acceleration amplitudes squared to the vibration frequency. © 2016, Springer Science+Business Media New York. Close

• 5. [Article] Long-Term Stability of 14YT-4Sc Alloy at High Temperature

  14YT alloy (Fe-14Cr-0.25wt.%Y2O3-0.4wt.%Ti) with 4 at.% Sc addition was previously reported to exhibit a nanoscale microstructure and high strength when annealed at temperatures up to 1000 °C (0.65Tm) ...

  Citation × Citation Citation Abstract Copy Title: Long-Term Stability of 14YT-4Sc Alloy at High Temperature Author: Li, Lulu, Xu, Weizong, Saber, Mostafa, Zhu, Yuntian, Koch, Carl C., Scattergood, Ronald O. Year: 2015 14YT alloy (Fe-14Cr-0.25wt.%Y2O3-0.4wt.%Ti) with 4 at.% Sc addition was previously reported to exhibit a nanoscale microstructure and high strength when annealed at temperatures up to 1000 °C (0.65Tm) for 1 hour. Here we report that the microstructure and mechanical behavior of 14YT-4Sc alloy after long-term annealing for up to 60 hours at 1000 °C. FIB analysis shows abnormal grain growth with annealing time, while a large fraction of the matrix still consists of nanoscale grains. TEM images reveal a slight growth of nano grains, with estimated grain growth exponent, n, to be 0.29. Sc-Ti-Y-O enriched nano oxide particles (nm) were observed in EDS mapping of the 14YT-4Sc-60h sample. The nano-structure retention at the high temperature of 1000 °C for 60 hours is attributed to these complex nano oxides. Title: Long-Term Stability of 14YT-4Sc Alloy at High Temperature Author: Li, Lulu, Xu, Weizong, Saber, Mostafa, Zhu, Yuntian, Koch, Carl C., Scattergood, Ronald O. Year: 2015 14YT alloy (Fe-14Cr-0.25wt.%Y2O3-0.4wt.%Ti) with 4 at.% Sc addition was previously reported to exhibit a nanoscale microstructure and high strength when annealed at temperatures up to 1000 °C (0.65Tm) for 1 hour. Here we report that the microstructure and mechanical behavior of 14YT-4Sc alloy after long-term annealing for up to 60 hours at 1000 °C. FIB analysis shows abnormal grain growth with annealing time, while a large fraction of the matrix still consists of nanoscale grains. TEM images reveal a slight growth of nano grains, with estimated grain growth exponent, n, to be 0.29. Sc-Ti-Y-O enriched nano oxide particles (nm) were observed in EDS mapping of the 14YT-4Sc-60h sample. The nano-structure retention at the high temperature of 1000 °C for 60 hours is attributed to these complex nano oxides. Close

• 6. [Article] Influence of Scandium Addition on the High-Temperature Grain Size Stabilization of Oxide-Dispersion-Strengthened (ODS) Ferritic Alloy

  The influence of 1–4 at% Sc addition on the thermal stability of mechanically alloyed ODS ferritic alloy was studied in this work. Sc addition was found to significantly stabilize grain size and microhardness ...

  Citation × Citation Citation Abstract Copy Title: Influence of Scandium Addition on the High-Temperature Grain Size Stabilization of Oxide-Dispersion-Strengthened (ODS) Ferritic Alloy Author: Li, Lulu, Xu, Weizong, Saber, Mostafa, Zhu, Yuntian, Koch, Carl C., Scattergood, Ronald O. Year: 2015 The influence of 1–4 at% Sc addition on the thermal stability of mechanically alloyed ODS ferritic alloy was studied in this work. Sc addition was found to significantly stabilize grain size and microhardness at high temperatures. Grain sizes of samples with 1 and 4 at% Sc was found maintained in the nanoscale range at temperatures up to 1000 °C with hardness maintained at 5.6 and 6.7 GPa, respectively. The detailed microstructure was also investigated from EDS elemental mapping, where nanofeatures [ScTiO] were observed, while nanosized [YTiO] particles were rarely seen. This is probably due to the concentration difference between Sc and Y, leading to the formation of [ScTiO] favoring that of [YTiO]. Precipitation was considered as the major source for the observed high temperature stabilization. In addition, 14YT–Sc alloys without large second phases such as Ti-oxide can exhibit better performance compared to conventional ODS materials. Title: Influence of Scandium Addition on the High-Temperature Grain Size Stabilization of Oxide-Dispersion-Strengthened (ODS) Ferritic Alloy Author: Li, Lulu, Xu, Weizong, Saber, Mostafa, Zhu, Yuntian, Koch, Carl C., Scattergood, Ronald O. Year: 2015 The influence of 1–4 at% Sc addition on the thermal stability of mechanically alloyed ODS ferritic alloy was studied in this work. Sc addition was found to significantly stabilize grain size and microhardness at high temperatures. Grain sizes of samples with 1 and 4 at% Sc was found maintained in the nanoscale range at temperatures up to 1000 °C with hardness maintained at 5.6 and 6.7 GPa, respectively. The detailed microstructure was also investigated from EDS elemental mapping, where nanofeatures [ScTiO] were observed, while nanosized [YTiO] particles were rarely seen. This is probably due to the concentration difference between Sc and Y, leading to the formation of [ScTiO] favoring that of [YTiO]. Precipitation was considered as the major source for the observed high temperature stabilization. In addition, 14YT–Sc alloys without large second phases such as Ti-oxide can exhibit better performance compared to conventional ODS materials. Close

• 7. [Article] Effect of Oxygen Content on Thermal Stability of Grain Size for Nanocrystalline Fe10Cr and Fe14Cr4Hf Alloy Powders

  Low oxygen content powders of high purity elemental Fe, Cr and Hf were produced in a glove box by mechanically filing the solid materials. Fe10Cr and Fe14Cr4Hf nanocrystalline alloy powders were processed ...

  Citation × Citation Citation Abstract Copy Title: Effect of Oxygen Content on Thermal Stability of Grain Size for Nanocrystalline Fe10Cr and Fe14Cr4Hf Alloy Powders Author: Roodposhti, Peiman Shahbeigi, Saber, Mostafa, Koch, Carl, Scattergood, Ronald Year: 2017 Low oxygen content powders of high purity elemental Fe, Cr and Hf were produced in a glove box by mechanically filing the solid materials. Fe10Cr and Fe14Cr4Hf nanocrystalline alloy powders were processed using these elemental powders in conjunction with SPEX ball milling. The grain-size stability of the nanocrystalline alloy powders was investigated for selected annealing temperatures. High temperature stabilization can be achieved by Zener pinning (kinetic mechanism) or segregation of Hf to grain boundaries (thermodynamic mechanism). Solute drag mechanisms can be effective at lower annealing temperatures. Recent regular solution models developed by the authors predict that Hf would facilitate thermodynamic grain-size stabilization in Fe14Cr4Hf alloys at high temperatures. However Hf-base reactions such as intermetallic phase or oxide formation can favor kinetic stabilization and this can dominate over a contribution from thermodynamic stabilization. In contrast, grain-size stabilization in Fe10Cr alloy would be a result of solute drag by the Cr solutes at lower temperatures. The results from previous investigations on Fe10Cr and Fe14Cr4Hf nanocrystalline alloys were (unknowingly at the time) influenced by the fact that the commercially available high purity elemental powders used for SPEX ball mill processing contained significant amounts of oxygen impurity. The results obtained in this investigation using identical processing methods with low oxygen content powders for synthesizing the alloys provide further insight into their stabilization mechanisms. Title: Effect of Oxygen Content on Thermal Stability of Grain Size for Nanocrystalline Fe10Cr and Fe14Cr4Hf Alloy Powders Author: Roodposhti, Peiman Shahbeigi, Saber, Mostafa, Koch, Carl, Scattergood, Ronald Year: 2017 Low oxygen content powders of high purity elemental Fe, Cr and Hf were produced in a glove box by mechanically filing the solid materials. Fe10Cr and Fe14Cr4Hf nanocrystalline alloy powders were processed using these elemental powders in conjunction with SPEX ball milling. The grain-size stability of the nanocrystalline alloy powders was investigated for selected annealing temperatures. High temperature stabilization can be achieved by Zener pinning (kinetic mechanism) or segregation of Hf to grain boundaries (thermodynamic mechanism). Solute drag mechanisms can be effective at lower annealing temperatures. Recent regular solution models developed by the authors predict that Hf would facilitate thermodynamic grain-size stabilization in Fe14Cr4Hf alloys at high temperatures. However Hf-base reactions such as intermetallic phase or oxide formation can favor kinetic stabilization and this can dominate over a contribution from thermodynamic stabilization. In contrast, grain-size stabilization in Fe10Cr alloy would be a result of solute drag by the Cr solutes at lower temperatures. The results from previous investigations on Fe10Cr and Fe14Cr4Hf nanocrystalline alloys were (unknowingly at the time) influenced by the fact that the commercially available high purity elemental powders used for SPEX ball mill processing contained significant amounts of oxygen impurity. The results obtained in this investigation using identical processing methods with low oxygen content powders for synthesizing the alloys provide further insight into their stabilization mechanisms. Close

• 8. [Article] Power core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses

  Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having ...

  Citation × Citation Citation Abstract Copy Title: Power core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses Author: Suhir, Ephraim, Nicolics, Johann Year: 2016 Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having a strong potential in the automotive industry and beyond. A natural reliability concern, however, is the level of the thermally induced stresses in a tri-material assembly of the type in question. Accordingly, an analytical (mathematical) stress model is developed for the evaluation of these stresses. The stresses include normal stresses acting in the cross-sections of the assembly components, and the interfacial shearing and peeling stresses acting at the interfaces of these components and at the interfaces of the embedded IC devices. The model can be helpful in the stress-analysis and physical design of the assemblies, in which the PC is sandwiched between two IMS’. It can be used also in other areas of engineering, where tri-material assemblies comprised of dissimilar materials and subjected to the change in temperature are employed. The general concepts are illustrated by a detailed numerical example. The analysis is an extension of the study carried out earlier for a bow-free assembly. It is noteworthy that although the calculations are carried out for the case when the assembly is cooled down from an elevated temperature to a low temperature, since a linear approach is used and the stresses are proportional to the change in temperature, whatever its sign or the magnitude is, the developed model is equally applicable to any change in temperature. Title: Power core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses Author: Suhir, Ephraim, Nicolics, Johann Year: 2016 Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having a strong potential in the automotive industry and beyond. A natural reliability concern, however, is the level of the thermally induced stresses in a tri-material assembly of the type in question. Accordingly, an analytical (mathematical) stress model is developed for the evaluation of these stresses. The stresses include normal stresses acting in the cross-sections of the assembly components, and the interfacial shearing and peeling stresses acting at the interfaces of these components and at the interfaces of the embedded IC devices. The model can be helpful in the stress-analysis and physical design of the assemblies, in which the PC is sandwiched between two IMS’. It can be used also in other areas of engineering, where tri-material assemblies comprised of dissimilar materials and subjected to the change in temperature are employed. The general concepts are illustrated by a detailed numerical example. The analysis is an extension of the study carried out earlier for a bow-free assembly. It is noteworthy that although the calculations are carried out for the case when the assembly is cooled down from an elevated temperature to a low temperature, since a linear approach is used and the stresses are proportional to the change in temperature, whatever its sign or the magnitude is, the developed model is equally applicable to any change in temperature. Close

• 9. [Article] Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen

  In some today's and future electronic and optoelectronic packaging systems (assemblies), including those intended for aerospace applications, the package (system's component containing active and passive ...

  Citation × Citation Citation Abstract Copy Title: Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen Author: Suhir, Ephraim, Bensoussan, Alain, Nicolics, Johann Year: 2015 In some today's and future electronic and optoelectronic packaging systems (assemblies), including those intended for aerospace applications, the package (system's component containing active and passive devices and interconnects) is placed (sandwiched) between two substrates. In an approximate stress analysis these substrates could be considered, from the mechanical (physical) standpoint, identical. Such assemblies are certainly bow-free, provided that all the stresses are within the elastic range and remain elastic during testing and operation. Ability to remain bow-free is an important merit for many applications. This is particularly true in optical engineering, where there is always a need to maintain high coupling efficiency. The level of thermal stresses in bow-free assemblies of the type in question could be, however, rather high. High thermal stresses are caused by the thermal contraction mismatch of the dissimilar materials of the assembly components and occur at low temperature conditions. These stresses include normal stresses acting in the component cross-sections and interfacial shearing and peeling stresses. The normal stresses in the component cross-sections determine the reliability of the component materials and the devices embedded into the inner component (package). The interfacial stresses affect the adhesive and cohesive strength of the assembly, i.e. its integrity. It should be pointed out that although the assembly as a whole is bow-free, the peeling stresses in it, whether thermal or mechanical, are not necessarily low: the two outer components (substrates) might exhibit appreciable warpage with respect to the bow-free inner component (package). While there is an incentive for using bow-free assemblies, there is also an incentive for narrowing the temperature range of the accelerated reliability testing: elevated temperature excursions might produce an undesirable shift in the modes and mechanisms of failure, i.e. lead to failures that will hardly occur in actual operation conditions. Failure oriented accelerated test (FOAT) specimens are particularly vulnerable, since the temperature range in these tests should be broad enough to lead to a failure, and, if a shift in the modes and mechanisms of failures takes place during significant temperature excursions, the physics of such failures might be quite different of those in actual operation conditions. Mechanical pre-stressing can be an effective means for narrowing the range of temperature excursions during accelerated testing and, owing to that, - for obtaining consistent and trustworthy information. If pre-stressing is considered, the ability to predict the thermo-mechanical stresses in the test specimen is certainly a must. Accordingly, the objective of this analysis is to obtain simple, easy-to-use, physically meaningful and practically useful closed form solutions for the evaluation of stresses in a bow-free test specimen of the type in question. The emphasis is on the role of compliant attachments, if any, between the inner and the two outer components. The developed model can be used at the design and accelerated test stages of the development of bow-free electronic and optoelectronic products. The compliant attachments, if any, could be particularly comprised of beamlike solder joint interconnections that, if properly designed, have a potential to relieve the thermal stresses to an extent that the low-cycle-fatigue state-of-stress is avoided. Title: Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen Author: Suhir, Ephraim, Bensoussan, Alain, Nicolics, Johann Year: 2015 In some today's and future electronic and optoelectronic packaging systems (assemblies), including those intended for aerospace applications, the package (system's component containing active and passive devices and interconnects) is placed (sandwiched) between two substrates. In an approximate stress analysis these substrates could be considered, from the mechanical (physical) standpoint, identical. Such assemblies are certainly bow-free, provided that all the stresses are within the elastic range and remain elastic during testing and operation. Ability to remain bow-free is an important merit for many applications. This is particularly true in optical engineering, where there is always a need to maintain high coupling efficiency. The level of thermal stresses in bow-free assemblies of the type in question could be, however, rather high. High thermal stresses are caused by the thermal contraction mismatch of the dissimilar materials of the assembly components and occur at low temperature conditions. These stresses include normal stresses acting in the component cross-sections and interfacial shearing and peeling stresses. The normal stresses in the component cross-sections determine the reliability of the component materials and the devices embedded into the inner component (package). The interfacial stresses affect the adhesive and cohesive strength of the assembly, i.e. its integrity. It should be pointed out that although the assembly as a whole is bow-free, the peeling stresses in it, whether thermal or mechanical, are not necessarily low: the two outer components (substrates) might exhibit appreciable warpage with respect to the bow-free inner component (package). While there is an incentive for using bow-free assemblies, there is also an incentive for narrowing the temperature range of the accelerated reliability testing: elevated temperature excursions might produce an undesirable shift in the modes and mechanisms of failure, i.e. lead to failures that will hardly occur in actual operation conditions. Failure oriented accelerated test (FOAT) specimens are particularly vulnerable, since the temperature range in these tests should be broad enough to lead to a failure, and, if a shift in the modes and mechanisms of failures takes place during significant temperature excursions, the physics of such failures might be quite different of those in actual operation conditions. Mechanical pre-stressing can be an effective means for narrowing the range of temperature excursions during accelerated testing and, owing to that, - for obtaining consistent and trustworthy information. If pre-stressing is considered, the ability to predict the thermo-mechanical stresses in the test specimen is certainly a must. Accordingly, the objective of this analysis is to obtain simple, easy-to-use, physically meaningful and practically useful closed form solutions for the evaluation of stresses in a bow-free test specimen of the type in question. The emphasis is on the role of compliant attachments, if any, between the inner and the two outer components. The developed model can be used at the design and accelerated test stages of the development of bow-free electronic and optoelectronic products. The compliant attachments, if any, could be particularly comprised of beamlike solder joint interconnections that, if properly designed, have a potential to relieve the thermal stresses to an extent that the low-cycle-fatigue state-of-stress is avoided. Close

• 10. [Article] Partial Decarburization and Intensive Quenching to Increase Fatigue Limit of Quenched Small Parts

  The 5160 spring steel is mainly used to endure fatigue and since its Mf is below room temperature, retained austenite is usually present after conventional quenching, which is detrimental from a fatigue ...

  Citation × Citation Citation Abstract Copy Title: Partial Decarburization and Intensive Quenching to Increase Fatigue Limit of Quenched Small Parts Author: Lozano, Diego E., Totten, George E., Martínez Cázares, Gabriela M., Mercado-Solis, Rafael David Year: 2014 The 5160 spring steel is mainly used to endure fatigue and since its Mf is below room temperature, retained austenite is usually present after conventional quenching, which is detrimental from a fatigue point of view. To reduce the amount of retained austenite, a partial decarburization was promoted (to increase the Ms and Mf, respectively) by austenitizing the steel at different temperatures and times in air, prior to performing an interrupted quenching in an accelerated media (brine) instead of the conventional oil quenching. The same quenching conditions with partial decarburization and without decarburization are compared. In addition, conventional oil quenching was performed as reference. Results showed that with a controlled partial decarburization, it is possible to increase the fatigue limit compared to the conditions without decarburization (both interrupted quenching and oil quenching). Fatigue experiments were carried out in a rotating bending fatigue type tester. Cooling curves, decarburization profiles, fraction of martensite plots, and fatigue data are discussed. Title: Partial Decarburization and Intensive Quenching to Increase Fatigue Limit of Quenched Small Parts Author: Lozano, Diego E., Totten, George E., Martínez Cázares, Gabriela M., Mercado-Solis, Rafael David Year: 2014 The 5160 spring steel is mainly used to endure fatigue and since its Mf is below room temperature, retained austenite is usually present after conventional quenching, which is detrimental from a fatigue point of view. To reduce the amount of retained austenite, a partial decarburization was promoted (to increase the Ms and Mf, respectively) by austenitizing the steel at different temperatures and times in air, prior to performing an interrupted quenching in an accelerated media (brine) instead of the conventional oil quenching. The same quenching conditions with partial decarburization and without decarburization are compared. In addition, conventional oil quenching was performed as reference. Results showed that with a controlled partial decarburization, it is possible to increase the fatigue limit compared to the conditions without decarburization (both interrupted quenching and oil quenching). Fatigue experiments were carried out in a rotating bending fatigue type tester. Cooling curves, decarburization profiles, fraction of martensite plots, and fatigue data are discussed. Close