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  • 14YT alloy (Fe-14Cr-0.25wt.%Y2O3-0.4wt.%Ti) with 4 at.% Sc addition was previously reported to exhibit a nanoscale microstructure and high strength when annealed at temperatures up to 1000 °C (0.65Tm) ...
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  • The influence of 1–4 at% Sc addition on the thermal stability of mechanically alloyed ODS ferritic alloy was studied in this work. Sc addition was found to significantly stabilize grain size and microhardness ...
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  • When simulating the formation and life cycle of secondary organic aerosol (SOA) with chemical transport models, it is often assumed that organic molecules are well mixed within SOA particles on the timescale ...
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  • 37 pages. A thesis presented to the Departments of Biology and Human Physiology and the Clark Honors College of the University of Oregon in partial fulfillment of the requirements for degree of Bachelor ...
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  • The Chehalis River Basin is located in the southwest region of Washington and is over 125 miles long flowing through agricultural, residential, industrial, and forest land. Four major rivers, many smaller ...
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  • Low oxygen content powders of high purity elemental Fe, Cr and Hf were produced in a glove box by mechanically filing the solid materials. Fe10Cr and Fe14Cr4Hf nanocrystalline alloy powders were processed ...
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  • The recently suggested probabilistic design-for-reliability (PDfR) concept and particularly its physically meaningful and flexible Boltzmann–Arrhenius–Zhurkov (BAZ) model, can be effectively employed as ...
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  • CE-QUAL-W2 is a 2-D hydrodynamic and water quality model that has been applied to reservoirs, lakes, river systems, and estuaries throughout the world. However, when this model is applied for shallow systems, ...
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  • We generate a series of novel indicators of spatially explicit watershed permeability and runoff characteristics to examine the relationship between land cover and water temperature parameters in a rapidly ...
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  • Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having ...
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