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Temperature
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Author
Suhir, Ephraim
Remove constraint Author: Suhir, Ephraim
Subject
Mechanical Engineering
Remove constraint Subject: Mechanical Engineering
Database
PDX Scholar
Remove constraint Database: PDX Scholar
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Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints ...
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Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having ...
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3. [Article] Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen
In some today's and future electronic and optoelectronic packaging systems (assemblies), including those intended for aerospace applications, the package (system's component containing active and passive ...Citation -
There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses ...
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It is shown that an engineering stress model suggested about 30 years ago for the approximate evaluation of the interfacial stresses in adhesively bonded or soldered bi-material assemblies experiencing ...
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6. [Article] Analysis of a Short Beam with Application to Solder Joints: Could Larger Stand-Off Heights Relieve Stress?
Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. ...Citation -
Physically meaningful and easy-to-use analytical stress model is developed for a short cylinder (beam) clamped at the ends and subjected to bending caused by the ends offset. The offset is due, in its ...
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