Search

Search Results

• 1. [Article] Intermetallic microlamination for high-temperature microreactors

  Chemical microreactors offer opportunities for portable power generation, on-site waste remediation and point-of-use chemical synthesis. Much of the existing development of microreactor devices involves ...

  Citation × Citation Citation Abstract Copy Title: Intermetallic microlamination for high-temperature microreactors Author: Dewey, Tyler Chemical microreactors offer opportunities for portable power generation, on-site waste remediation and point-of-use chemical synthesis. Much of the existing development of microreactor devices involves silicon-based microfabrication techniques. It is recognized that new refractory materials are important to realizing high-temperature microreactors. Requirements of these materials include high-temperature resistance, chemical inertness and low-cost microfabrication. Advances in multilayer ceramics hold promise for the fabrication of microreactor structures from ceramic tape. Problems include creep, moderate levels of densification, and volumetric shrinkage, all of which can lead to dimensional instability. Intermetallics are another class of refractory materials which may hold some promise for high-temperature microreactor development. In this paper, a new method of forming microchannel arrays from thin layers of intermetallics is demonstrated. This method has the advantage of eliminating volumetric shrinkage due to binder removal. Various iterations of NiAl intermetallic conversion and bonding are presented. Results show that the NiAl system may be suitable as a substrate for microchannel reactor designs. Title: Intermetallic microlamination for high-temperature microreactors Author: Dewey, Tyler Chemical microreactors offer opportunities for portable power generation, on-site waste remediation and point-of-use chemical synthesis. Much of the existing development of microreactor devices involves silicon-based microfabrication techniques. It is recognized that new refractory materials are important to realizing high-temperature microreactors. Requirements of these materials include high-temperature resistance, chemical inertness and low-cost microfabrication. Advances in multilayer ceramics hold promise for the fabrication of microreactor structures from ceramic tape. Problems include creep, moderate levels of densification, and volumetric shrinkage, all of which can lead to dimensional instability. Intermetallics are another class of refractory materials which may hold some promise for high-temperature microreactor development. In this paper, a new method of forming microchannel arrays from thin layers of intermetallics is demonstrated. This method has the advantage of eliminating volumetric shrinkage due to binder removal. Various iterations of NiAl intermetallic conversion and bonding are presented. Results show that the NiAl system may be suitable as a substrate for microchannel reactor designs. Close