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1. [Article] Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance
The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases ...Citation -
The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed ...
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3. [Article] Estimation of Transient Temperature Distribution during Quenching, via a Parabolic Model
A material-independent model to estimate the transient temperature distribution in a test probe quenched by immersion is presented in this study. This model is based on the assumption that, under one-dimensional ...Citation -
Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints ...
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14YT alloy (Fe-14Cr-0.25wt.%Y2O3-0.4wt.%Ti) with 4 at.% Sc addition was previously reported to exhibit a nanoscale microstructure and high strength when annealed at temperatures up to 1000 °C (0.65Tm) ...
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The influence of 1–4 at% Sc addition on the thermal stability of mechanically alloyed ODS ferritic alloy was studied in this work. Sc addition was found to significantly stabilize grain size and microhardness ...
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7. [Article] Effect of Oxygen Content on Thermal Stability of Grain Size for Nanocrystalline Fe10Cr and Fe14Cr4Hf Alloy Powders
Low oxygen content powders of high purity elemental Fe, Cr and Hf were produced in a glove box by mechanically filing the solid materials. Fe10Cr and Fe14Cr4Hf nanocrystalline alloy powders were processed ...Citation -
Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and passive integrated circuit (IC) devices is currently viewed as an attractive advanced packaging option having ...
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9. [Article] Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen
In some today's and future electronic and optoelectronic packaging systems (assemblies), including those intended for aerospace applications, the package (system's component containing active and passive ...Citation -
10. [Article] Partial Decarburization and Intensive Quenching to Increase Fatigue Limit of Quenched Small Parts
The 5160 spring steel is mainly used to endure fatigue and since its Mf is below room temperature, retained austenite is usually present after conventional quenching, which is detrimental from a fatigue ...Citation