Search
You searched for:
Start Over
Temperature
Remove constraint Temperature
Subject
Ball grid array technology
Remove constraint Subject: Ball grid array technology
Database
PDX Scholar
Remove constraint Database: PDX Scholar
1 - 2 of 2
Search Results
-
There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses ...
Citation -
Physically meaningful and easy-to-use analytical stress model is developed for a short cylinder (beam) clamped at the ends and subjected to bending caused by the ends offset. The offset is due, in its ...
Citation