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Temperature
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Author
Ghaffarian, Reza
Remove constraint Author: Ghaffarian, Reza
Author
Suhir, Ephraim
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Subject
Mechanical Engineering
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Subject
Microelectronic packaging -- Materials
Remove constraint Subject: Microelectronic packaging -- Materials
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There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses ...
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Physically meaningful and easy-to-use analytical stress model is developed for a short cylinder (beam) clamped at the ends and subjected to bending caused by the ends offset. The offset is due, in its ...
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