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Temperature
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Author
Ghaffarian, Reza
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Author
Suhir, Ephraim
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Year
within 10 Years
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Subject
Ball grid array technology
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Subject
Microelectronic packaging -- Materials
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Subject
Optical materials -- Technological innovations
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Database
PDX Scholar
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There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses ...
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